Description Direct Digital Manufacturing (DDM) combines additive and subtractive manufacturing methods to fully fabricate Printed Circuit Structures (PCS). Harnessing the flexibility of additive methods, designers may embed electronics into functional structures. ... read more

Description High reliable lead-free alloys are suitable for high operating temperatures and longer temperature-cycling time. ... read more

Description When evaluating solder paste for use, mechanical reliability is one feature of interest. The performance of an electronic assembly in a vehicle, for example, may hinge on a solder alloy’s resilience to vibration fatigue. ... read more

Description For an automotive transmission control unit (TCU) platform, the bottom ground pad of a high power low-profile quad flat package (LQFP) component soldered to the thermal pad of the PCB had a void specification limit of 25% for optimum heat dissipation. ... read more

Description The research goal was to establish a limit for the number of rework cycles for Ball Gird Arrays (BGAs) and to determine the clearance required between a BGA and its surrounding components on an assembly without impacting the overall Printed Circuit Board (PCB) and Printed Circuit Assembly (PCA) r ... read more

Description Repair of soldered components is a constant necessity in the electronics industry. Product performance enhancement, damaged components, and exchange of wrong placed components are some of the motivations behind a repair. ... read more

Description During the past few years, it has become increasingly difficult to physically rework printed circuit board (PCB) assemblies. ... read more

Description Highly reliable and high-yield prototyping in the early stages of development is crucial for innovations in next generation microelectronic systems to demonstrate the results of research. ... read more

Description Different types of components with soldered bottom terminations are increasingly used in the electronics industry with the principal objective to improve heat dissipation. ... read more

Description The Semi-Additive Process (SAP) is a standard process to enable very fine lines and spaces to produce highly sophisticated Integrated Circuit Substrates (ICS). ... read more

Description The next generation devices using high frequency of 5G to mmWave and greater has called for innovation in materials used in electronics manufacturing to realize the optimum signal integrity and performance. ... read more

Description PCB Fabricators have long since abandoned Hot-Air Levelling, with several alternative final finishes (ImAg, ImSn, OSP, ENIG and ENEPIG) now well established as having a track record of meeting fabricators cost/performance requirements. ... read more

Description Aerospace and defense applications present unique challenges for material suppliers. As increasingly adoption of wide bandgap semiconductor materials and advanced diverse accessible heterogeneous integration technologies, power density of defense and aerospace devices increases rapidly. ... read more

Description The rapid change to and steep rise of electric vehicles (EV) results in many challenges for the design, manufacturing, testing, and the understanding of reliability and robustness for printed circuit board (PCB) in automotive powertrain applications. ... read more

Description “Light weighting” has become an important trend in numerous manufacturing divisions. Lightweight materials are particularly valuable in any portable device including mass transit systems, automotive systems, and portable tools. ... read more

Description Selective soldering utilizes wettable metal nozzles for controlled application of solder to components. The wetting of solder to the nozzles is part of a complex mechanism that causes wear of the nozzle due to chemical interaction between the solder and the nozzle. ... read more

Description Surface mount technology was developed in the 1960s and implemented on printed circuit boards in the 1980s. High-density electronic assemblies are dominated nowadays by surface mount devices. The number of through-hole components left on the assembly continuously declines. ... read more

Description Advanced implementation of wearables and IOT applications require attachment of components on lightweight, mechanically flexible, and low-cost substrates. ... read more

Description Selective electrodeposition (brush plating) was successfully used to rework a solder-contaminated, hard gold-plated copper flag connector for a circuit card assembly (CCA). ... read more

Description The iNEMI flowers of sulfur (FoS) corrosion chamber was developed to study creep corrosion on printed circuit board assemblies(PCBAs). The chamber, typically run at 50 or 60oC, has corrosive sulfur and chlorine gases along with relative humidity controlled in the 11 to 90% range. ... read more

Description Environmental dust accumulation on electronic equipment can impact the performance and reliability of the equipment in various ways. ... read more

Description Inspection means have increasingly been incorporated into typical manufacturing of boards, substrates and/or systems. A significant number of automatic inspections rely on the analysis of images that are acquired by a multitude of means such as Optical, X-Ray, Infrared, Acoustic microscopy. ... read more

Description Digitalization changes everything, everywhere. It is inevitable, new business drivers are forcing the Electronics industry to rethink every element of their business. Virtually every company is talking about innovation and digitalization. And a major driver is the so-called Digital Twin. ... read more

Description As the reflow soldering process is the main energy consumer in a SMT assembly line, there is a high potential for cost reduction by significantly reducing the amount of energy needed. ... read more

Description As miniaturization trends continue in the electronics industry, System in Package (SiP) technology is gaining more and more traction. In many ways, some SiP modules are just surface mount technology in a high-density package. ... read more

Description The advance in technology and its relentless develop mentis delivering yet another surface mount assembly challenge. ... read more

Description Polymer coating materials protect electronics from harsh environments, assuring safe and reliable performance. To reach the highest level of reliability, coatings must be selectively applied to avoid keep out zones and critical components, such as connector pins, test points, and relays. ... read more

Description The development of an automated circuit card assembly(CCA)conformal coating process using a low outgassing polyurethane material was essential for meeting the increase in customer demand from 3,000 to 60,000 units per year. ... read more

Description Light-curable materials can provide significant benefits over conventional technologies, including lower operating costs driven by lower labor needs, space savings, lower energy demand, and higher throughput. ... read more

Description To support regulations on hazardous substances in materials and in products like the automotive EU End of Life Vehicle (ELV) directive, the Electronics and Electrical Equipment Restriction of Hazardous Substances (RoHS) regulations and the EU Registration Evaluation Authorization and restriction ... read more

Description Until recently, virtually all restricted materials in electronics were classified as either carcinogens (e.g. Pb) or reproductive toxins (e.g. phthalates). Two new categories of restricted materials have emerged -endocrine disrupting chemicals (EDCs) and persistent organic pollutants (POP). ... read more

Description The High Density Packaging (HDP) User Group has completed a project based upon an earlier project evaluating the different types of high frequency test methods used in the industry for measuring Dk and Df at high frequencies. ... read more

Description Earlier HDP User Group project work that has been completed and published compared the different types of high frequency test methods used in the industry for measuring Dk and Df at high frequencies. The HDP project test results being reported on in this paper are based upon that earlier work. ... read more

Description As electronic assembly designs have increased in density and component packaging size and lead pitch have decreased in size, this has placed tighter requirements on manufacturing processes. ... read more

Description This slide show presents solutions to the relevant Power Module question: "What has to be considered within a PCB, if currents with about 50 A and voltages above 500 V should be designed?"  The electrical and thermo-mechanical capabilities are critical constraints.  2D and 3D CAD models can be ut ... read more

Description The operation and reliability of any electronic assembly is very dependent on the performance, quality and consistency of the bare printed circuit board (PCB). ... read more

Description A number of similar Printed Wiring Assemblies (PWAs) had been subjected to final electrical tests on automated test equipment when a common test failure was recognized. ... read more

Description SMT-flux residues are feared to be a potential risk factor for quality issues in electronic assembly and interconnect technology. ... read more

Description In a lead-free reflow process, temperatures are higher, and materials use outgasses more than in a leaded reflow process. The trends toward higher density populated boards and more pin-in-paste technology also increase solder paste use. ... read more

Description ENIG, electroless nickel immersion gold is now a well-regarded finish used to enhance and preserve the solder-ability of copper circuits. ... read more

Description The latest highest reliability requirements demand a high performance electroless nickel and immersion gold (HP ENIG). The new IPC specification 4552A has refocused the industry with reference to nickel corrosion. ... read more

Description This paper details the realization of a multi-layered, printed, conformable hybrid circuit. The circuit was created using silver(Ag) flake ink as a conductive layer and UV acrylic-based ink as a dielectric layer. ... read more

Description As is the case with many other markets where faster, highly capable technologies have resulted in more intelligent processes and products, the medical device sector is also undergoing a “smart” transformation. ... read more

Description -- ... read more

Description This Presentation discusses Improvements for signal integrity.  Signal integrity is based on the copper surface roughness, the oxides on the copper, and the Dielectric constant of the Dielectric material.  The Dielectric material dielectric constant is effected by the glass weave and the weave pa ... read more

Description This Slide show presents RF Cap Layers to normal FR4 Dielectric materials.  This material can be used in multiple configurations including Single sided, Double sided, and Hybrid.   This material contains different and enhanced Dielectric Frequencies for Radio Frequency PCBs.   ... read more

Description OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. ... read more

Description Electronic assembly processes range from simple to complex and involve a wide range of materials to produce. Each step in the process and each assembly material used will have some impact on the assembly, most affecting the cleaning process window. ... read more

Description Since the 1970s, ROSE testing was used to determine “clean enough.” In 2015, the J-STD-001 committee assigned a team to develop the next generation of “cleanliness” requirements. Section 8 defines the key concepts that drove the need for developing new cleanliness requirements. ... read more

Description A nano-Cu pressureless sinterable paste was developed for joint formation applications. The material was further engineered in both chemistry and process for enhanced oxidation resistance. ... read more