Description Via-in-Pad Plated Over (VIPPO) designs enable better signal quality and speed, but also cause unintended consequences. ... read more

Description There is increasing environmental awareness within society, affecting legislation, commerce, and industry. Nature offers an abundance of macromolecules and smaller molecular weight compounds that provide renewable sources for polymers, as opposed to crude oil. ... read more

Description The cost of test has always been a main concern in the electronics manufacturing business. The recent proliferation of 5G, Internet of Things (IoTs) is driving the industry with smart devices on consumer products, medical products, industrial, as well as automotive industries. ... read more

Description Instead of using a dedicated test platform, we are presenting methods of using modular and highly scalable components to perform functional testing on a printed circuit board assembly (PCBA). ... read more

Description Today, more than 40% of cyber-attacks target IoT devices, and where attacks themselves are commercialized, it is becoming essential to take countermeasures against cyber-attacks, not only for defense but also for intrusion. ... read more

Description For many years, the focus of the exchange of design and manufacturing data has been related to the reduction of lead-time in getting products to market, with the reduction of design-turns, engineering effort, and the number of inevitable mistakes associated with any manual manipulation of data. ... read more

Description What went wrong, when did it happen and what have we learned? How often have we been confronted with these simple and direct words describing a situation where the outcome is undesirable! ... read more

Description Per- and polyfluoroalkyl substances (PFAS) is a class of fluoro-organic materials that is both ubiquitous and essential to the semiconductor manufacturing process as well as the downstream consumer electronics that semiconductors are incorporated into. ... read more

Description In this paper, we highlight the best practices for eco-design in electronics as presented during a multi-part learning series. ... read more

Description Low Temperature Solder (LTS) is increasingly being used as a replacement for SAC305 solder alloy. ... read more

Description The 2017 International Electronics Manufacturing Initiatives (iNEMI) Board and Assembly Roadmap had forecast a 20% adoption rate of low-temperature solders (LTS) for board assembly by 2027. BiSn solders are the leading low-temperature candidates. ... read more

Description Two challenges that advanced packaging suppliers are faced with during IC substrate fabrication are meeting the copper plating performance requirements and reducing manufacturing process costs. ... read more

Description For many years, the electroless copper process has been widely used by the PCB and package substrate industries, where a wide process window and proven product reliability has led to it being considered as the “industry standard” as a means of facilitating multilayer PCBs. ... read more

Description The High Density Packaging (HDP) user group has completed a project to evaluate dielectric conditions impacting the reliability of backdrilling escape vias under BGA via arrays. Large BGA sites are characterized by high density routing channels and finer pitch arrays of BGA escape vias. ... read more

Description The number of components and functionality on a printed circuit board increases continuously. Surface mount device (SMD) components become smaller, pitch dimensions shrink, but there are still some through-hole components used on most assemblies. ... read more

Description Rapid incorporation of low cost, small footprint, and high efficiency BTC components with a large thermal plane and leadless terminations presents numerous challenges to the PCB manufacturers. ... read more

Description Many leading solder paste manufacturers are currently developing solder alloys for high reliability applications. These solder alloys are doped with elements such as bismuth (Bi), indium (In), and antimony (Sb), which improves the fatigue life and reduces the adverse effects of thermal cycling. ... read more

Description The soldering (wave, reflow, and selective) along with flux removal (cleaning) processes have for years been optimized to yield the best result possible. Today more than ever these processes are stressed by the continued trend toward miniaturization and increased power capability. ... read more

Description Flip-chip technology has become increasingly prevalent within the electronics industry due to its lower cost, increased package density, improved performance while maintaining or improving circuit reliability, and increased I/O density. ... read more

Description Recently new semi-aqueous in-line cleaning machines (CM) were installed; however, the associated increased volumes of circuit card assemblies (CCAs) being cleaned after SMT surface mount technology assembly resulted in correspondingly more solder paste residue or “goo” building-up on cleaning mac ... read more

Description Traditional Subtractive Etch (SE) processes used to manufacture Printed Circuit Boards (PCBs) are adequate for many of today’s circuit designs. ... read more

Description This paper will discuss the evolution of the printed board design to date, how process improvements and new manufacturing technologies and chemistry have enabled the new step down in miniaturization. ... read more

Description This paper will discuss the difference between traditional advanced any layer HDI PCB with subtractive process and Ultra High-Density Interconnect (Ultra HDI) or substrate-like-PCB (SLP) with modified Semi-Additive Process (mSAP). ... read more

Description Complex geometries, customized parts and new processes; these are characteristics that are readily associated with additive manufacturing (AM). At the same time, they are often associated with high hurdles in terms of mass production, suitability for series production and reliability. ... read more

Description Multilevel Additively Manufactured (AME) circuits and devices have been enabling circuit design and implementation that is not possible or is very expensive using traditional methods such as PCB production. ... read more

Description Surface mounted passive electrical components are beginning to reach hard limits for further reduction in size of their packages. Performance of the raw materials used have set capabilities for their volumes. ... read more

Description Thermal management must advance with the military’s requirements for increased performance, lower costs, and rapid technology changes. ... read more

Description Structural electronics enables design innovation by adding electronic functions to smart surfaces with 3-dimensional form factors. This paper describes the making of a structural electronics technology demonstrator that uses polypropylene (PP) film and injection molding (IM) resin. ... read more

Description Stretchable electronics is a new innovation and becoming popular in various fields, especially in the health care sector. ... read more

Description The journey to creating a connected factory can be a scary and arduous task, with some not even knowing where to start. ... read more

Description Specialists in IIoT and Industry 4.0 at the Manufacturing Technology Centre have developed the first stage of Europe's first smart factory demonstrator for the manufacture of electronic assemblies, helping electronics manufacturers “go digital”, transforming their businesses, and meeting the dema ... read more

Description Automation is growing in nearly every sector. Self-driving cars, touchless soft-drink dispensing machines that deliver over 100 different drinks, and robots doing everything from food sorting to helping pack packages. ... read more

Description Companies that place products onto the marketplace, whether they are internally manufactured or sourced from a supply chain, are often faced with ever increasing demands for data from a diverse set of stakeholders, requiring a multitude of different data reporting needs to be identified and reque ... read more

Description Traditionally sourcing strategies are resolved by a “make or buy” process where companies evaluate if it is more cost effective to make or buy a product. ... read more

Description The challenge of decrease PCB manufacturing environmental impact is here to stay. The rate at which a company can process change is key to strategical advantage. Any increase of the change rate requires resources in R&D. ... read more

Description The electronics industry is seeing more data being computed through printed circuit boards (PCBs). For example, to support 5G communications, most electronics will need to increase their processing speed compared to the previous system (4G) in order to support data transfer rates. ... read more

Description Electroless palladium plating has been present in the PCB industry for over 20 years providing highly reliable finishes for high end applications in combination with nickel and gold plating. ... read more

Description Purpose ... read more

Description The growing use of electronics in every area of our lives around the world has resulted in an increased awareness of potential environmental issues related to their use and disposal. ... read more

Description The excellent IPC-TR-587 technical report, ‘Conformal Coating Material and Application ‘‘State of the Industry’’ Assessment’ delivers the results of a recent major study on conformal coating, outlining an IPC study of major conformal coating types, coating application techniques, and coating cure ... read more

Description A surface insulation resistance study is presented on coated B52-like test boards where a large number of QFN components of different package designs are coated with non-optimal conformal coating process parameters creating bubbles at the QFN leads. ... read more

Description A supplier was experiencing laminate cracks in an FR4 dielectric constructed material product after successfully producing this Printed Circuit Board (PCB) for a number of years. ... read more

Description This paper documents an investigation of printed circuit board (PCB) failures due to edge burn outs. Electrical shorts were observed at late-stage environmental stress screening and electrical testing. Failed boards had burn marks at edges that were absent of components or surface circuitry. ... read more

Description A dynamic flex test was performed on a spacecraft instrument harness composed of multiple individual flex cables, with each flex cable containing multiple copper traces. ... read more

Description Miniaturization and harsh environment market drivers within the electronics industry are presenting new challenges in terms of predictive reliabilities of control standards. ... read more

Description In 2017, the Society of Automotive Engineers (SAE) G-24 committee approved revision activity for GEIA-STD-0005-1A, “Standard for Managing the Risks of Pb-free Solders and Finishes in ADHP Electronic Systems” (formerly known as “Performance Standard for Aerospace and High-Performance Electronic Sy ... read more

Description Electrical contacts, although critically important for a wide range of applications, are susceptible to degradation due to fretting corrosion, especially when sliding and vibrations occur. To overcome fretting corrosion and sliding wear, lubricants are often used. ... read more

Description This work provides analytical solutions to the temperature rise of one-dimensional conductors such as whiskers and wires. Whisker growth from metal surfaces of electrical connectors and other components has shown itself to create reliability issues. ... read more

Description The FIDES guide 2009 (Edition A) proposes a methodology for the reliability assessment of electronic to evaluate and control product reliability progress throughout life cycle. ... read more

Description Compliant press-fit connections using a pure tin finish are prone to spontaneous long whisker growth after press-in, which may result in malfunction of the electronic circuits. The origin of those whiskers is case dependent and difficult to observe by optical microscopy methods. ... read more