Description The method to measure intermetallic compound layer thickness is discussed in a paper recently published by the author[1]. The method uses voltage/current sources, voltmeters, and electrolytes depending on the measurements and the type of material. ... read more

Description Light emitting diodes (LEDs) are widely used throughout the electronics industry due to their high efficiency, lumen output, and expected lifetime. LEDs are semiconductor devices that are commonly used as indicator lights on printed circuit board assemblies (PCBAs). ... read more

Description The proliferation of Artificial Intelligence (AI), big data, 5G, electric vehicles, Internet of Things (IoT), Edge Computing,High Performance Computing (HPC) and Electric Vehicle (EV) in recent years has necessitated the increased use of electronics. ... read more

Description In this study, a patent-pending new solder paste material has been developed for assembly of System in Package (SiP) with outstanding slump resistance without compromising the paste volume printed, and the solder joint service temperature. ... read more

Description Use of low-cost Aluminum based flexible printed circuit boards or Al-PCBs has been growing in popularity. Integrating them with conventional Copper based PCBs or Cu-PCBs is essential for their large-scale adoption. ... read more

Description The assembly of complex optical systems such as objective lenses for smartphone cameras, autonomous driving sensors / cameras, and light detection and ranging (LiDAR) require precise alignment during their production. ... read more

Description Printed Circuit Structures (PCSs) have the potential to revolutionize next generation printed circuit boards (PCBs) and electronics packaging. ... read more

Description In the LIFT (Laser Induced Forward Transfer) technology, a material, evenly coated on a transparent carrier film, passes under a laser. The laser applies a short burst of energy to it. This releases perfectly consistent drops of material onto the substrate below. ... read more

Description In the last few years there have been concerns in the industry, especially in products requiring high reliability when using microvia structures. As a result, many fabricators have been mandating push back on very complex high layer count designs. ... read more

Description Plated and filled microvias are a common feature in modern PCBs, so much so, that they are now considered as the industry norm as a means of achieving high-density designs for modern mobile devices. ... read more

Description Traditional PCB fabrication technology incorporates copper-plated vias after each press lamination connecting with microvias or mechanical vias. ... read more

Description Microvia technology has been used in production since the 1990s. In the beginning, the design freedom for HDI PCBs was only limited by the imagination of the designer, resulting in some very ambitions construction. ... read more

Description As Printed Circuit Board (PCB) designs increase in density, the need for High Density Interconnect (HDI) structures such as microvias is also increasing. With this uptick in microvia usage, there has also been an increase with reliability concerns. ... read more

Description As has long been known, each time there is a step up to the next level of PCB technology, the industry is faced with new or the broadening of existing challenges. Today, this is particularly true of microvias. ... read more

Description This paper presents test methods to effectively perform conducted testing on RF and high-speed data connectors for automotive applications. ... read more

Description In comprehensive humidity tests for the release of materials and processes for the assembly and interconnect technology of PCBAs of the automotive industry, the solder resist has emerged as a particular focus of defects with regard to electrochemical migration. ... read more

Description The viscosity of conformal coatings is critical in producing consistent and reliable applications of coating onto a printed circuit board (PCB). ... read more

Description A comprehensive SIR test-protocol for the release of materials and processes in the automotive industry is presented. ... read more

Description As Conductive Anodic Filament (CAF) testing on Printed Circuit Boards (PCBs) approaches 50 years of industry attention, the chemistry of formation in the lab environment is well documented, significant resources have been expended in passing the lab test, and new efforts are in progress to make t ... read more

Description As the manufacturing sector is under constant pressure to satisfy customers’ demands in a competitive market by applying complex processes to meet manufacturing cost and schedule goals, the need to identify quality variables within processes is occurring at a faster rate. ... read more

Description To ensure the highest possible quality standards in automotive electronics production, an extensive implementation of testing and inspection systems throughout production is mandatory. ... read more

Description The key challenge for industry in adopting AI into their manufacturing processes surrounds the accessibility of their data. Many manufacturing industries, especially electronics manufacturing, suffer from a lack of standard data protocols often due to the use of legacy equipment. ... read more

Description Neural network based deep learning models increasingly demonstrates high accuracy in object detection and image classification in digital image processing. The manufacturing industry is adapting this advanced technology to assist in automated quality assurance. ... read more

Description Photonic soldering utilizes high intensity flashes of visible light to achieve wide area heating with exceptional uniformity. Solder paste is heated to its liquidus temperature using radiative energy transfer, and light is converted to heat through optical absorption. ... read more

Description IPC-HERMES-9852 as the smart replacement for the long-used IPC-SMEMA-9851 provides machine-to-machine (M2M) communication that ensures consistency of each PCB and its individual data while traveling down an SMT Line in production.  Thus, Hermes enables machines to consistently transfer a PCB toge ... read more

Description With the advancement of emerging technologies such as AI, Cloud and Block Chain, the electronics manufacturing industry is entering a new era of smart manufacturing. ... read more

Description The Factory of the Future or a Lights out Factory will require significant automation, including many functions that are challenging and are still performed manually due to the complexity and human dexterity needed. ... read more

Description The IPC Connected Factory Exchange (IPC-CFX) standard provides genuine plug-and-play IIoT data exchange between machines and supervisory systems across the shop floor. ... read more

Description With the Industry 4.0 transformation going full steam ahead, analytics have transformed the industry from being process-driven to now data-driven, where data speaks for itself. Conventionally, only failed measurement data are logged for repair and troubleshooting purposes. ... read more

Description This case analysis evaluates the thermal profile of 10 FETs rated at 48V, 250A under 100 secs soak time with all the thermally enhanced mechanical attachments installed. ... read more

Description Liquid metal alloys (LMAs), GaIn, and Galinstan, have been paid considerable attention as thermal interface materials (TIM) for usage of thermal management in microprocessor packages, including CPU, GPU and HPC, in PCs and super computers. ... read more

Description Modern electronics are prone to experience electromagnetic interference (EMI) which hinders proper functioning of the devices due to the increasing number of wireless devices and the miniaturization. ... read more

Description Thermal interface materials (TIMs) are ubiquitous in electronics cooling in a wide variety of applications in industrial, automotive and consumer electronics [1]. These materials are typically comprised of a soft polymeric matrix with thermally conductive fillers. ... read more

Description In a previous paper [8], solid liquid hybrids (SLHs) were presented as a combination of metals that are solid at room temperature with ones that are liquid at room temperature. ... read more

Description In the present research, we have studied the influence of Ag additives on wettability, adhesion, oxidation, viscosity and modulus of liquid metal on two alloys – Liquid Metal 1 (“LM1”) (62.5Ga, 21.5In, 13Sn) and Liquid Metal 2 (“LM2”) (78.6Ga, 21.4In)– to develop new thermal interface materials f ... read more

Description Light weight, conformal and portable standalone power solutions are becoming increasingly important for powering wearable electronics including fabric embedded sensors, to monitor the physi ... read more

Description Wearable devices for biomedical applications have become more popular due to the increasing demand on health monitoring for both consumer and medical fields. ... read more

Description SINTEC is the project name for a Liquid metal alloy technology with the goal of creating flexible and stretchable electronics.  These stretchable electronics are applicable to wearable sensors that collect motion data of humans.   The stretching allows direct application of wearable electronics t ... read more

Description Textile-based touch sensing offers a novel solution towards creating flexible and robust tactile interfaces that fit within an existing manufacturing ecosystem.  Current fabric-based touch sensors can measure distributed and nuanced touch while maintaining textile qualities such as stretching and ... read more

Description ... read more

Description The research presented in this slide show utilizes E-Textiles.  The applications include: ... read more

Description The DoD conducted a survey of PCB companies and the effects of COVID19.  The survey results showed that: ... read more

Description Indiana Integrated Circuits has developed "Quilted" modular PCBs.  They consist of multiple small "boardlets" with traces or pads on rough edges of the boards.  These rough edges fit together with other boards like a jigsaw puzzle.  This type of in board encoding ensures high security from tamper ... read more

Description The Dod Executive Agent For Printed Circuit Board and Interconnect Technology (PrCB EA) has a vested interest in the state of the electronics industrial base and its ability to sustain and improve national defense systems.  By using a two-year cycle, the PrCB EA creates both a report and a supple ... read more

Description This paper describes a new design approach to improve the cost efficiency of the “Flexible Printed Circuit” board (FPC also known as FPCB, “FPC” hereafter) by analyzing the impact of the board outline shape to the FPC manufacturing panel utilization during the early design phase. ... read more

Description To magnify data transmission efficiency, high electrical performance of PCB boards is required for 112Gbps. The required operation frequency tends to increase, and target loss tends to decrease. ... read more

Description This slide show discusses the different categories of SMT components including, BTCs, dual and quad leaded packages, and passives.  The component use cases and typical challenges are exemplified with charts and images. ... read more

Description The lack of material provenance in today’s supply-chain allows the undetected ingress of counterfeit materials to increase at alarming levels. Chemicals, components, including critical ICs, as well as simple passive components, assemblies and finished goods are all subjected to this threat. ... read more

Description One of the most important aspects of the IPC Digital Twin standard, is the enablement of interoperability between many digital twin-based solutions across many facets of the holistic manufacturing technical and business process. ... read more

Description The purpose of conformal coatings is to protect printed circuit boards and components mounted on them from the deleterious effects of moisture, particulate matter and corrosive gases. ... read more