IPC Document Revision Table

IPC has hundreds of standards, guidelines, handbooks, and tools to help you build electronics better. 

All of IPC's current and historical documents are catalogued below. If you do not see the document that you're looking for, make sure to check the 'obsolete and superseded documents' tab at the bottom of the page. 

If you have any questions, please contact answers@ipc.org. 

Product ID Document Name Responsible Committee Status DoD
J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies  5-22a

Rev J 4/24
Rev H 9/20
Rev G Am1  10/18
Rev G 10/17
Rev F WAM1  2/16
Rev F Am 1  12/15
Rev F 08/14
Rev E  4/10
Rev D Amend 1  4/08
Rev D 2/05
Rev C 3/00
Rev B 10/96
Rev A 1/95
Orig. 4/92
Supersedes IPC-S-815

 07/01
J-STD-001xA/A-610xA Automotive Addendum Automotive Addendum to IPC J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610 Acceptability of Electronic Assemblies
The addendum MUST be used with the same version of the standard; e.g. 001/A-610		  

Rev HA  10/21
Rev GA  2/20

  
J-STD-001xS Space Hardware Addendum Space Applications Electronic Hardware Addendum for J-STD-001. The addendum MUST be used with the same version of the standard; e.g. 001CS with 001C, 001DS with 001D, 001ES with 001E 5-22as

HS 5/21
GS Amend 1  3/20
GS 4/18
FS Am1 2/17
FS 02/15
ES 12/10
DS Amend 1 9/09
DS 11/06
CS 1/04 

 04/21
IPC-HDBK-001 Handbook and Guide to the Requirements for Soldered Electrical and Electronic Assemblies  5-22f Rev H 3/21
Rev F  2/16
Rev E  2/12
Amend 2  10/05
Amend 1  12/00
Orig. 3/98		 07/01
SMC-TR-001 An Introduction to Tape Automated Bonding Fine Pitch Technology    No Longer Maintained*
Orig. 1/89		  
IT-WP-001 Myths of E-Commerce    No Longer Maintained*
Orig. 9/00		  
SMC-WP-001 Soldering Capability White Paper Report    No Longer Maintained*
Orig. 8/91		  
SMEMA 1.2 Mechanical Equipment Interface Standard   No Longer Maintained*
Update IPC-SMEMA-9851 		  
JP002 Current Tin Whiskers Theory and Mitigation Practices Guideline 5-23e No Longer Maintained*
Orig.  3/06		  
J-STD-002 Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires  5-23b Rev E 11/17
Rev D 6/13
Rev C Amend 1 10/08
Rev C 12/07
Rev B  2/03
Rev A 10/98
Orig. 4/92
Supersedes IPC-S-805		 05/95
SMC-WP-002 An Assessment of the Use of Lead in Electronic Assembly    Obsolete without replacement
Orig. 8/92		  
J-STD-003 Solderability Tests for Printed Boards  5-23a Rev D 1/23
Rev C WAM 1&2  9/17
Rev C Amend 1 9/14
Rev C 9/13
Rev B  2/07
Rev A  2/03
Original 4/92
Supersedes IPC-S-804		 01/04
SMC-WP-003 Chip Mounting Technology    No Longer Maintained*
Orig. 8/93		  
SMEMA 3.1 Fiducial Mark Standard       
J-STD-004 Requirements for Soldering Fluxes  5-24a Rev C - 01/22 
Rev B Amend 1 – 11/11
Rev B 12/08
Rev A  1/04
Orig. 1/95
Supersedes IPC-SF-818		 05/95
SMC-WP-004 Design for Success    No Longer Maintained*
Orig. 4/97		  
SMEMA 4 Reflow Terms and Definitions       
J-STD-005 Requirements for Soldering Pastes  5-24b Rev B 4/24
Rev A 2/12
Amend 1  6/96
Orig. 1/95
Supersedes IPC-SP-819		 05/95
SMC-WP-005 PWB Surface Finishes    No Longer Maintained*
Orig. 4/97		  
IPC-HDBK-005 Guide to Solder Paste Assessment 5-24b No Longer Maintained*
Orig. 1/06		  
SMEMA 5 Screen Printing Terms and Definitions       
J-STD-006 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications  5-24c Rev C Amend 1  11/17
Rev C 7/13
Rev B Amends 1 & 2 10/09
Rev B Amend 1  6/08
Rev B  1/06
Rev A  5/01
Amend 1  7/96
Orig. 1/95		 05/95
IPC-WP-006 Round Robin Testing & Analysis: Lead-Free Alloys, Tin, Silver, & Copper SPVC No Longer Maintained*
Orig. 8/03		  
SMEMA 6 Electronics Cleaning Terms and Definitions       
SMEMA 7 Fluid Dispensing Terms and Definitions       
         
IPC-WP-008 Setting up Ion Chromatography Capability 5-30 No Longer Maintained*
Orig. 12/05		  
IPC-WP-009 A Summary of Tin Whisker Research References   No Longer Maintained*
Orig. 3/09		  
IPC-WP-010 A Summary of Fungus Resistance Test Methods 5-30    
J-STD-012 Implementation of Flip Chip and Chip Scale Technology  5-21g Superseded by IPC-7094    10/13
Orig. 1/96		  
IPC-WP-012 Pb-free Electronics Risk Management (PERM) Council Pb-free Research Priorities  8-81D Orig. 5/14  
J-STD-013 Implementation of Ball Grid Array and Other High Density Technology  5-21f Superseded by IPC-7095   10/13
Orig. 7/96		  
IPC-WP-013 Analytical Procedures for Portable Lead-Free Alloy Test Data SPVC No Longer Maintained*
Orig. 5/14		  
IPC-WP-014 Pb-free Electronics Risk Management (PERM) Council Position on the use of Pb-free Electronics in the Aerospace, Defense and High Performance Electronic Industries 8-81 Rev A 3/20
Orig. 7/14		  
IPC-WP-015 Pb-free Electronics Risk Management (PERM) Council Pb-free Rebaseline 8-81 No Longer Maintained*
Orig. 4/14		  
IPC-WP-016 PC Round Robin Study -Conformal Coatings Moisture and Insulation Resistance and Dielectric Withstanding Voltage   No Longer Maintained*
Orig. 2/13		  
IPC-WP-017 What Conformal Coaters Wish Designers Knew About Coatings   No Longer Maintained*
Orig. 10/15		  
IPC-DRM-18 Component Identification Desk Reference Manual    No Longer Maintained*
Rev J  2/18
Rev H 11/07
Rev G 9/03
Rev F 8/01
Rev E 8/00
Rev D 7/99
Rev C 7/98
Rev B 2/97
Rev A 4/96
Orig. 9/95		  
IPC-WP-019 An Overview on Global Change in Ionic Cleanliness Requirements   Rev B  9/20
Rev A  9/18
Orig. 8/17		  
J-STD-020 Moisture/Reflow Sensitivity Classification of Plastic Surface Mount Devices  B-10a Rev F 11/22
Rev E 2/15
Rev D Amend 1  3/08
Rev D  8/07
Rev C 7/04
Rev B 7/02
Rev A 4/99
Orig. 10/96		  
IPC-WP-021 Considerations of New Classes of Coatings for IPC-CC-830 Revision C   Orig. 9/19  
IPC/PERM-WP-022 Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow - Results of an Industry Round-Robin - Final Report 8-81F No Longer Maintained*
Orig. 8/18		  
IPC-WP-023 IPC Technology Solutions White Paper on Performance-Based Printed Board OEM Acceptance: Via Chain Continuity Reflow Test: The Hidden Reliability Threat – Weak Microvia Interface V-TSL Orig. 5/19  
IPC-WP-024 Smart Textiles Reliability Following Laundering D-70 No Longer Maintained*
Orig. 8/18		  
IPC-WP-025 A Framework for the Engineering and Design of E-Textiles D-70 Orig. 4/19  
J-STD-026 Semiconductor Design Standard for Flip Chip Applications  5-21g No Longer Maintained*
Orig. 8/99		  
IPC-WP-026 IPC Technology Solutions White Paper on Blockchain and the Electronics Industry: A review of the current state of the blockchain technology and its potential applications in electronics manufacturing V-TSL Orig. 9/19  
IPC-WP-028 Guidance on Objective Evidence for Validating the Acceptability of Bubbles in Conformal Coatings   Orig. 2/24  
J-STD-027 Mechanical Outline Standard for Flip Chip or Chip Scale Configurations  5-21g No Longer Maintained*
Orig.  2/03		  
J-STD-028 Performance Standard for Flip Chip Scale Bumps  5-21g No Longer Maintained*
Orig. 8/99		  
J-STD-030 Selection and Application of Board Level Underfill Materials 5-24f No Longer Maintained*
Rev A 3/14
Orig. 9/05		  
J-STD-032 Performance Standard for Ball Grid Array Bumps and Columns  5-21f No Longer Maintained*
Orig. 6/02		  
J-STD-033 Packaging and Handling of Moisture Sensitive Non-Hermetic Solid State Surface Mount Devices  B-10a No Longer Maintained*
Rev D  5/18
Rev C Amend 1  8/14
Rev C 2/12
Rev B Amend 1  1/07
Rev B 10/05
Rev A 7/02
Orig. 4/99		  
J-STD-035 Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components  B-10a Rev A 11/22
Orig. 4/99		  
IPC-0040 Optoelectronic Assembly and Packaging Technology   5-25 No Longer Maintained*
Orig. 5/03		  
J-STD-046 Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers (revision of JESD46D)
Joint JEDEC/IPC/ECIA 		 2-15f No Longer Maintained*
Orig. 11/16		  
J-STD-048 Notification Standard for Product Discontinuance 2-15f No Longer Maintained*
Orig. 5/15		  
IPC-T-50 Terms and Definitions for Interconnecting and Packaging Electronic Circuits  2-30 Rev N 11/21
Rev M 6/15
Rev K 7/13
Rev J 10/11
Rev I Skipped Due to Conflict with “L” and “1”
Rev H  7/08
Rev G 12/03
Rev F 6/96
Rev E 7/92
Rev D 11/88
Rev C 3/85
Rev B 6/80
Rev A 8/76
Orig. 8/75		 09/80
IPC-T-51 Terms and Definitions for Design and Manufacture of Printed Electronics D-64a Orig. 4/22  
IPC-DRM-53 Introduction to Electronics Assembly    No Longer Maintained*
Orig. 6/00		  
IPC-SC-60 Post Solder Solvent Cleaning Handbook  5-31a Superseded and combined into CH-65B 5/11
Rev A 8/99
Orig. 4/87		  
IPC-SA-61 Post-Solder Semi-Aqueous Cleaning Handbook  5-31b Superseded and combined into CH-65B 5/11
Rev A 6/02
Orig. 7/95		  
IPC-AC-62 Post Solder Aqueous Cleaning Handbook  5-31b Superseded and combined into CH-65B 5/11
Rev A 1/96
Orig. 12/86		  
IPC-CH-65 Guidelines for Cleaning of Printed Boards and Assemblies  5-31d

No Longer Maintained*
Rev B 7/11
Rev A 9/99
Orig. 12/90

  
IPC-CS-70 Guidelines for Chemical Handling Safety in Printed Board Manufacturing    Obsolete without replacement
Orig. 8/88		  
EIA/IPC/JEDEC-J-STD-075 Classification of Passive and Solid State Devices for Assembly Processes B-10a REV A 11/22
Orig. 8/08		  
IPC-CM-78 Guidelines for Surface Mounting and Interconnecting Chip Carriers    Superseded by IPC-SM-780
Rev C – 3/88
Orig. 11/83		  
IPC-MP-83 IPC Policy on Metrication    Obsolete without replacement
Orig. 8/85 		  
IPC-PC-90 General Requirements for Implementation of Statistical Process Control  7-22 Superseded by IPC-9191
Orig. 10/90		 W02/03
IPC-QS-95 General Requirements for Implementation of ISO 9000 Quality Systems  7-22 Obsolete without replacement
Orig. 4/93		  
IPC-L-108 Specification for Thin Metal Clad Base Materials for Multilayer Printed Boards  3-11 Superseded by IPC-4101
Rev B  6/90
Rev A 10/80
Orig. 3/76		  
IPC-L-109 Specification for Resin Impregnated Fabric (Pregreg) for Multilayer Printed Boards  3-11 Superseded by IPC-4101
Rev B  7/92
Rev A 10/80
Orig. 3/76		  
IPC-L-110 Preimpregnated, B-Stage Epoxy-Glass Cloth for Multilayer Printed Circuit Boards  3-11 Rev A Superseded by IPC-L-109 and IPC-4101  
IPC-CC-110 Guidelines for Selecting Core Constructions for Multilayer Printed Wiring Board Applications  3-11c Superseded by IPC-4121
Rev A 12/97
Orig. 1/94		  
IPC-L-112 Specification for Composite Metal Clad Base Materials for Printed Boards  3-11 Superseded by IPC-4101
Rev A 6/92
Orig. 7/81		  
IPC-WP-113 Guidance for the Development and Implementation of a Red Plague Control Plan (RPCP) 7-31k & 7-31h No Longer Maintained*
Orig. 12/15		  
IPC-WP-114 Guidance for the Development and Implementation of a White Plague Control Plan (WPCP) 7-31k & 7-31h No Longer Maintained*
Orig. 12/15		  
IPC-L-115 Specification for Rigid Metal Clad Base Materials for Printed Boards  3-11 Superseded by IPC-4101
Rev B 4/90
Rev A 10/80
Orig. 3/77		  
IPC-WP-116 Guidance for the Development and Implementation of a Foreign Object Debris (FOD) Control Plan 7-31k & 7-31h No Longer Maintained*
Orig. 12/15		  
IPC-L-120 Inspection Procedure for Chemical Processing Suitability of Copper-Clad Epoxy-Glass Laminates    Obsolete without replacement  
IPC-L-125 Specifications for Plastic Substrates Clad or Unclad for High Speed/High Frequency Interconnections  D-23 Superseded by IPC-4103
Rev A 7/92
Orig. 8/83		  
IPC-L-130 Specifications for Thin Laminates, Metal Clad, Primarily for General-Purpose Multilayer Printed Boards  3-11 Superseded by IPC-L-108 and IPC-4101
Orig. 1/77		  
IPC-DD-135 Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip Modules    Obsolete without replacement
Orig. 8/95		  
IPC-EG-140 Specification for Finished Fabric Woven from “E” Glass for Printed Boards  3-12d Superseded by IPC-4412
Amend 1 & 2 6/97
Orig. 3/88		 W02/03
IPC-SG-141 Specification for Finished Fabric Woven from “S” Glass for Printed Boards  3-12d No Longer Maintained*
Orig. 2/92		 7/93
IPC-A-142 Specification for Finished Fabric Woven from Aramid for Printed Boards  3-12 No Longer Maintained*
Orig. 6/90		 W05/12
IPC-QF-143 General Specification for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards  3-12d No Longer Maintained*
Orig. 2/92		 W6/11
IPC-CF-148 Resin Coated Metal for Printed Boards  3-12c Superseded by IPC-4563
Rev A 9/98
Orig. 6/90		  
IPC-MF-150 Metal Foil for Printed Wiring Applications  3-12a Superseded by IPC-4562 5/00
Amend 1 8/92
Rev F 10/91 Changed from CF-150 to MF-150
Rev E 5/81
Rev D 3/76
Rev C 8/74
Rev B 2/71
Rev A 9/67
Orig. 8/66		 W02/02
IPC-CF-152 Composite Metallic Material Specification for Printed Wiring Boards  3-12h No Longer Maintained*
Rev B 12/97
Rev A 1/94
Orig. 6/90		  
IPC-FC-203 Specification for Flat Cable, Round Conductor, Ground Plane  D-13 Obsolete 7/96
Orig. 7/85		  
IPC-FC-210 Performance Specification for Flat-Conductor Undercarpet Power Cable (Type FCC)  D-13 Obsolete 7/96
Orig. 9/85		  
IPC-FC-213 Performance Specification for Flat Undercarpet Telephone Cable  D-13* Obsolete 7/96
Orig. 9/84		  
IPC-FC-217 General Document for Connectors, Electric, Header, Receptacle,Insulation Displacement for Use with Round Conductor Flat Cable  D-13 Obsolete 7/96
Reaffirmed 4/90
Orig. 8/82		  
IPC-FC-218B/EIA-RS-429 General Specification for Connectors, Electrical Flat Cable Type  D-13 Obsolete 7/96
Reaffirmed 5/91
Reaffirmed 11/81
Orig. 7/76		  
IPC-FC-219 Environment Sealed Flat Cable Connectors for use in Aerospace Applications  D-13 Obsolete 7/96
Orig. 5/84		  
IPC-FC-220 Specification for Flat Cable, Flat Conductor, Unshielded  D-13 Obsolete 7/96
Rev C 7/85
Rev B 8/75
Rev A 1/74
Orig. 5/70		  
IPC-FC-221 Specification for Flat-Copper Conductors for Flat Cables  D-13 Obsolete 7/96
Rev A 5/84
Orig. 8/75		  
IPC-FC-222 Specification of Flat Cable Round Conductor, Unshielded  D-13 Obsolete 7/96
Reaffirmed 5/91
Orig. 6/80		  
IPC-FC-225 Flat Cable Design Guide  D-13 Obsolete 7/96
Reaffirmed 10/85
Orig. 8/75		  
IPC-FC-231 Flexible Base Dielectrics for Use in Flexible Printed Wiring  D-13 Superseded by IPC-4202
Amend 10/95
Rev C 4/92
Rev B 2/86
Rev A 5/83
Orig. 7/74		 W03/03
IPC-FC-232 Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Wiring and Flexible Bonding Films  D-13 Superseded by 4203 5/02
Amend 10/95
Rev C 6/94
Rev B 2/86
Rev A 5/83
Orig. 7/74		 W03/03
IPC-FC-233 Flexible Adhesive Bonding Films  D-13 Incorporated into IPC-FC-232C 6/94
Rev A 2/86
Orig. 5/83		 W11/03
IPC-FC-234 PSA Assembly Guidelines for Single- & Double-Sided Flexible Printed Circuits  D-1 No Longer Maintained*
Rev A 12/14
Orig. 12/97		  
IPC-FC-240 Single sided flex  D-12 Superseded by IPC-6013
Incorporated into FC-250
Rev B 1/74
Rev A 5/69
Orig. 12/65		  
IPC-FC-241 Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Wiring  D-13* Superseded by IPC-4204
Amend 10/95
Rev C 4/92
Rev B 2/86
Rev A 5/83
Orig. 7/74		 W02/02
IPC-RF-245 Performance Specification for Rigid-Flex Printed Boards  D-12 Superseded by IPC-6013
Orig. 4/87		  
IPC-D-249 Design Standard for Flexible Single-and Double-Sided Printed Boards  D-11 Superseded by IPC-2223
Orig. 1/87		  
IPC-FC-250 Specification for Single – and Double-Sided Flexible Printed Wiring  D-12 Superseded by IPC-6013
Rev A 9/86
Orig. 1/74		  
IPC-FA-251 Guidelines for Single and Double Sided Flex Circuits  D-12 No Longer Maintained*
Orig. 2/92		  
IPC-D-275 Design Standard for Rigid Printed Boards and Rigid Printed Board Assemblies  D-31b Superseded by IPC-2221 and 2222
Supersedes IPC-D-319 and IPC-D-949
Amendment 1  4/96
Orig. 9/91		 W10/09
IPC-RB-276 Qualification and Performance Specification for Rigid Printed Boards  D-33a Superseded by IPC-6011 and IPC-6012
Orig. 3/92; Supersedes IPC-SC-320B and IPC-ML-950C		  
IPC-D-279 Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies  6-10b No Longer Maintained*
Orig. 7/96		  
IPC-D-300 Printed Board Dimensions and Tolerances  1-10a Superseded by IPC-2615
Rev G 1/84
Rev F 11/74
Rev E 10/70
Rev D 1/70
Rev C 10/65
Rev B 1/64
Rev A 7/61
Orig. 8/60		  
IPC-D-310 Guidelines for Phototool Generation and Measurement Techniques    No Longer Maintained*
Rev C  6/91
Rev B 12/85
Rev A 12/77
Orig. 9/69		  
IPC-A-311 Process Control Guidelines for Phototool Generation and Use    No Longer Maintained*
Orig. 3/96		  
IPC-D-316 Design Guide for Microwave Circuit Boards Utilizing Soft Substrates  D-21b Superseded by IPC-2252
Orig. 5/95		  
IPC-D-317 Design Guidelines for Electronic Packaging Utilizing High-Speed Techniques  D-21a Superseded by IPC-2251
Rev A 1/95
Orig. 4/90		  
IPC-HF-318 Microwave End Product Board Inspection and Test  D-22 Superseded by IPC-6018
Rev A 12/91
Orig. 6/85		  
IPC-D-319 Design Standard for Rigid Single-and Double-Sided Printed Boards  D-31b Superseded by IPC-D-275, then by IPC-2221/2222
Orig. 1/87		  
IPC-SD-320 Performance Specification for Rigid Single- and Double-Sided Printed Boards  D-33a Superseded by IPC-RB-276
Supersedes IPC-TC-500
Rev B 11/86
Rev A 3/81
Orig. 1/77		  
IPC-D-322 Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes    Reaffirmed 9/91
Orig. 8/84		 10/94
IPC-MC-324 Performance Specifications for Metal Core Boards  D-33a Superseded by IPC-6011 and IPC-6012
Orig. 10/88		  
IPC-D-325 Documentation Requirements for Printed Boards, Assemblies and Support Drawings  2-40

No Longer Maintained*
Partially Superseded:
Schematic Drawings Superseded by IPC-2612 and IPC-2612-1. 
Fabrication Drawings Superseded by IPC-2614. 
Dimensioning and Tolerancing Superseded by IPC-2615. 
For all other documentation requirements, continue to use IPC-D-325.
Rev A 5/95
Orig. 1/87

  
IPC-D-326 Information Requirements for Manufacturing Printed Board Assemblies  2-11a No Longer Maintained*
Rev A 1/04
Orig. 4/91		  
IPC-D-330 Design Guide Manual    No Longer Maintained*
Orig. 1/92		  
IPC-PD-335 Electronic Packaging Handbook    No Longer Maintained*
Orig. 12/89		  
IPC-NC-349 Computer Numerical Control Formatting for Drillers and Routers    No Longer Maintained*
Orig. 8/85		 10/85
IPC-D-350 Printed Board Description in Digital Form 2-11 No Longer Maintained*
Rev D 7/92
Rev C 10/85
Rev B 8/77
Rev A 2/75
Orig. 8/72		 07/78
IPC-D-351 Printed Board Drawings in Digital Form    No Longer Maintained*
Orig. 8/85		 09/85
IPC-D-352 Electronic Design Data Description for Printed Boards in Digital Form    No Longer Maintained*
Orig. 8/85		 09/85
IPC-D-354 Library Format Description for Printed Boards in Digital Form    No Longer Maintained*
Orig. 2/87		  
IPC-D-355 Printed Board Assembly Description in Digital Form    No Longer Maintained*
Orig. 1/95		  
IPC-D-356 Bare Board Electrical Test Information in Digital Form  2-11c No Longer Maintained*
Rev B 10/02
Rev A 1/98
Orig. 3/92		 08/92
IPC-AM-361 Specification for Rigid Substrates for Additive Process Printed Boards    Superseded by IPC-4101
Orig. 1/82		  
IPC-MB-380 Guidelines for Molded Interconnection Devices    No Longer Maintained*
Orig. 10/90		  
IPC-D-390 Automated Design Guidelines    No Longer Maintained*
Rev A 2/88
Orig. 7/74		  
IPC-C-406 Design and Application Guidelines for Surface Mount Connectors    No Longer Maintained*
Orig. 1/90		  
IPC-CI-408 Solderless Surface Mount Connector Design Characteristics and Application Guidelines B-22c No Longer Maintained*
Orig. 1/94		  
IPC-BP-421 General Specification for Rigid Printed Board Backplanes with Press Fit Contacts    Obsolete without replacement
Reaffirmed 4/90
Orig. 10/80		  
IPC-D-422 Design Guide for Press Fit Rigid Printed Board Backplanes    No Longer Maintained*
Orig. 9/82		  
IPC-DW-424 General Specification for Encapsulated Discrete Wire Interconnection Boards    No Longer Maintained*
Orig. 1/95		  
IPC-DW-425 Design and End Product Requirements for Discrete Wiring Boards    No Longer Maintained*
Rev A 5/90
Orig. 9/82		 03/94
IPC-DW-426 Specifications for Assembly of Discrete Wiring    No Longer Maintained*
Orig. 12/87		  
IPC-TR-460 Trouble-Shooting Checklist for Wave Soldering Printed Wiring Boards    No Longer Maintained*
Rev A 2/84
Orig. 1973		  
IPC-TR-461 Solderability Evaluation of Thick and Thin Fused Coatings    No Longer Maintained*
Orig. 3/79		  
IPC-TR-462 Solderability Evaluation of Printed Boards with Protective Coatings Over Long Term Storage    No Longer Maintained*
Orig. 10/87		  
IPC-TR-464 Accelerated Aging for Solderability Evaluations  5-23b No Longer Maintained*
Addendum 12/87
Orig. 4/84		  
IPC-TR-465-1 Round Robin Test on Steam Ager Temperature Control Stability    No Longer Maintained*
Orig. 1993		  
IPC-TR-465-2 The Effect of Steam Aging Time and Temperature on Solderability Test Results    No Longer Maintained*
Orig. 1993		  
IPC-TR-465-3 Evaluation of Steam Aging on Alternative Finishes, Phase IIA    No Longer Maintained*
Orig. 7/96		  
IPC-TR-466 Wetting Balance Standard Weight Comparison Test    No Longer Maintained*
Orig. 4/95		  
IPC-TR-467 Supporting Data and Numerical Examples for ANSI/J-STD-001 Appendix D    No Longer Maintained*
Orig. 10/96		  
IPC-TR-468 Factors Affecting Insulation Resistance Performance of Printed Boards    No Longer Maintained*
Orig. 3/79		  
IPC-TR-470 Thermal Characteristics of Multilayer Interconnection Boards    No Longer Maintained*
Orig. 1/74		  
IPC-TR-474 An Overview of Discrete Wiring Techniques    Obsolete without replacement
Reprint 1984
Orig. 3/79		  
IPC-TR-476 How to Avoid Metallic Growth Problems on Electronic Hardware Rev A Electrochemical Migration Electrically Induced Failures In Printed Assemblies    No Longer Maintained*
Rev A 6/84 (new title)
Orig. 9/77		  
IPC-TR-480 Results of Multilayer Test Program Round Robin IV Phase I    Obsolete without replacement
Orig. 9/75		  
IPC-TR-481 Results of Multilayer Test Program Round Robin V    No Longer Maintained*
Orig. 4/81		  
IPC-TR-482 New Developments in Thin Copper Foils    No Longer Maintained*
Orig. 1/76		  
IPC-TR-483 Dimensional Stability Testing of Thin Laminates – Report on Phase I International Round Robin Test Program    No Longer Maintained*
Rev A 3/91
Addendums 10/87
Orig. 4/84		  
IPC-TR-484 Results of IPC Copper Foil Ductility Round Robin Study    No Longer Maintained*
Orig. 4/86		  
IPC-TR-485 Results of Copper Foil Rupture Strength Test Round Robin Study    No Longer Maintained*
Orig. 3/85		  
IPC-TR-486 Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations    No Longer Maintained*
Orig. 7/01		  
IPC-TR-549 Measles in Printed Wiring Boards    No Longer Maintained*
Orig. 11/78		  
IPC-TR-551 Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Components    No Longer Maintained*
Orig. 7/93		  
IPC-DR-570 General Specification for 1/8 Inch Diameter Shank Carbide Drills for Printed Boards  4-12 No Longer Maintained*
Rev A 4/84
Orig. 1/79		  
IPC-DR-572 Drilling Guidelines for Printed Boards  4-12 No Longer Maintained*
Rev A  3/07
Orig. 4/88		  
IPC-TR-575 Additive Process Evaluation-Report on Phase I IPC Round Robin Testing Program on Additive Printed Wiring Boards   Obsolete without replacement
Orig. 4/75		  
IPC-TR-576 Additive Process Evaluation    Obsolete without replacement
Orig. 9/77		  
IPC-TR-577 Additive Process Evaluation - Report on Phase III IPC Round Robin Testing Program on Rigid Additive Printed Boards   Obsolete without replacement
Orig. 4/80		  
IPC-TR-578 Leading Edge Manufacturing Technology Report – Resulting of a Round Robin Study on Minimum Conductor Width and Plated-Through Holes in Rigid, Bare Copper, Double-Sided Printed Wiring Boards    No Longer Maintained*
Orig. 9/84		  
IPC-TR-579 Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in Printed Wiring Boards    No Longer Maintained*
Orig. 9/88		  
IPC-TR-580 Cleaning and Cleanliness Test Program Phase 1 Test Results    No Longer Maintained*
Orig. 10/89		  
IPC-TR-581 IPC Phase 3 Controlled Atmosphere Soldering Study    No Longer Maintained*
Orig. 8/94		  
IPC-TR-582 IPC Phase 3 No-Clean Flux Study    No Longer Maintained*
Orig. 11/94		  
IPC-TR-583 An In-Depth Look At Ionic Cleanliness Testing   No Longer Maintained*
Orig. 7/02		  
IPC-WP/TR-584 IPC White Paper and Technical Report on Halogen-Free Materials used for Printed Circuit Boards and Assemblies 4-33 No Longer Maintained*
Rev A  8/07
Orig.  4/03		  
IPC-TR-585 Time, Temperature and Humidity Stress of Final Board Finish Solderability   No Longer Maintained*
Orig.  5/06		  
IPC-TR-586 Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium (supports IPC-4553A) 4-14 No Longer Maintained*
Orig. 5/09		  
IPC-TR-587 Conformal Coating Material and Application ‘‘State of the Industry’’ Assessment Report 5-22ARR Orig. 7/20  
IPC-A-600 Acceptability of Printed Boards  7-31a & D-33a Rev K  7/20
Rev J  6/16
Rev H  4/10
Rev G Amend 1  1/08
Rev G  7/04
Rev F 11/99
Rev E 8/95
Rev D '89
Rev C '78
Rev B '74
Rev A '70
Orig. '64		  
IPC-SS-605 Printed Board Quality Evaluation Slide Set    Obsolete without replacement  
IPC-QE-605 Printed Board Quality Evaluation Handbook  7-31c No Longer Maintained*
Rev A 2/99		  
J-STD-609 Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb) Pb-Free and Other Attributes and Devices 4-34b Rev B 11/16
Rev A  3/10
Orig. 5/07; supersedes IPC-1066		 01/08
IPC-A-610 Acceptability of Electronic Assemblies  7-31b Rev J 3/24
Rev H 9/20
Rev G 10/17
Rev F WAM1  2/16
Rev F Amend 1  12/15
Rev F  8/14
Rev E  4/10
Rev D Amend 1 4/08
Rev D 2/05
Rev C Amend 1 11/01
Rev C 1/00
Rev B 12/94
Rev A 3/90
Orig. 8/83		 02/02
IPC-A-610G-R Rail Transit Addendum to IPC-A-610G Acceptability of Electronic Assemblies 7-31r Rev. G-R 3/22  
IPC-A-610xC IPC-A-610xC Telecom Addendum 7-31bc GC 1/20
FC 2/17
DC 8/09 (orig.)		  
IPC-HDBK-610 Handbook and Guide to IPC-A-610 (Includes B-C-D comparison)   No Longer Maintained*
Amend 1  10/05
Orig. 9/02		  
IPC-QE-615 Assembly Quality Evaluation Handbook    Obsolete without replacement  
IPC-D-620 Design and Critical Process Requirements for Cable and Wiring Harnesses  7-31k Rev A 12/21
Orig.  2/16		  
IPC/WHMA-A-620 Acceptability of Electronic Wire Harnesses and Cables  7-31f Rev E 10/22
Rev D 1/20
Rev C 1/17
Rev B Amend 1 8/13
Rev B 10/12
Rev A 7/06
Orig. 1/02		  
IPC/WHMA-A-620 REDLINE Acceptability of Electronic Wire Harnesses and Cables    Rev C to D  5/20
Rev B to C  3/17		  
IPC/WHMA-A-620 Space Hardware Addendum Space Applications Electronic Hardware Addendum for IPC/WHMA-A-620. The addendum MUST be used with the same version of the standard; e.g. 620CS with 620C 7-31fs Rev E-S  10/23
Rev D-S  9/20
Rev C-S  4/18
Rev B-S  6/13
Rev A-S Amend 1  7/12
Rev A-S  1/11		  
IPC/WHMA-A-620CR Rail Transit Addendum to IPC/WHMA-A-620C 7-31r Rev. CR 3/22  
IPC-HDBK-620 Handbook and Guide to IPC-D-620 and IPC/WHMA-A-620  7-31h/7-31k Orig 6/18  
IPC-A-630 Acceptability Standard for Manufacture, Inspection and Testing of Electronic Enclosures 7-31j Orig. 9/13  
IPC-HDBK-630 Guidelines for Design, Manufacture, Inspection, and Testing of Electronic Enclosures   7-31j No Longer Maintained*
Orig. 7/14		  
IPC-A-640 Acceptance Requirements for Optical Fiber, Optical Cable, and Hybrid Wiring Harness Assemblies  7-31m

Rev. A 3/22
Orig. 7/17

  
IPC-AI-640 User’s Guidelines for Automated Inspection of Unpopulated Thick Film Hybrid Substrates    Obsolete without replacement
Orig. 1/87		  
IPC-D-640 Design and Critical Process Requirements for Optical Fiber, Optical Cable and Hybrid Wiring Harness Assemblies 7-31m

Rev. A 4/22
Orig. 9/16

  
IPC-AI-641 User’s Guidelines for Automated Solder Joint Inspection    Obsolete without replacement
Orig. 1/87		  
IPC-AI-642 User’s Guidelines for Automated Inspection of Artwork, Interlayers, and Unpopulated PWB’s    Obsolete without replacement
Orig. 10/88		  
IPC-OI-645 Standard for Visual Optical Inspection Aids  7-31d Orig. 10/93  
IPC-TM-650 Test Methods Manual    Updated per test method  
IPC-ET-652 Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards    Superseded by IPC-9252
Orig. 10/90		  
IPC-QL-653 Qualification of Facilities that Inspect/Test Printed Boards, Components, and Material  7-10c Rev A 11/97
Orig. 8/88		 07/89
IPC-MI-660 Incoming Inspection of Raw Materials Manual    No Longer Maintained*
Orig. 2/84		  
IPC-R-700 Suggested Guidelines for Modification, Rework and Repair of Printed Boards and Assemblies    Superseded by IPC-7711A/7721A
Rev C 1/88
Rev B 9/77
Rev A 12/71
Orig. 9/67		  
IPC-TA-720 Technology Assessment Handbook on Laminates    No Longer Maintained*
Orig. ’86 		  
IPC-TA-721 Technology Assessment Handbook on Multilayer Boards    No Longer Maintained*
Orig. ’88		  
IPC-TA-722 Technology Assessment of Soldering    No Longer Maintained*
Orig. ’90		  
IPC-TA-723 Technology Assessment Handbook on Surface Mounting    No Longer Maintained*
Orig. ’91		  
IPC-TA-724 Technology Assessment Series on Cleanrooms    No Longer Maintained*
Orig. 4/98		  
IPC-PE-740 Troubleshooting Guide for Printed Board Manufacture and Assembly  7-23 No Longer Maintained*
PWB Sections superseded by IPC-9121
Rev A 12/97
Orig. 1/85		  
IPC-CM-770 Guidelines for Printed Board Component Mounting  5-21a No Longer Maintained*
Rev E 1/04
Rev D 1/96
Rev C 1/87
Rev B 10/80
Rev A 3/76
Orig. 9/68		  
IPC-SM-780 Component Packaging and Interconnecting with Emphasis on Surface Mounting    No Longer Maintained*
Orig. 3/88		  
IPC-SM-782 Surface Mount Design and Land Pattern Standard  1-13 Superseded by IPC-7351
Rev A Amend 2  4/99
Rev A Amend 1  10/96
Rev A 8/93
Orig. 3/87		  
IPC-SM-784 Guidelines for Chip-on-Board Technology Implementation    No Longer Maintained*
Orig. 11/90		  
IPC-SM-785 Guidelines for Accelerated Reliability Test of Surface Mount Solder Attachments    No Longer Maintained*
Orig. 11/92		  
IPC-SM-786 Procedures for Characterizing and Handling of Moisture/ Reflow Sensitive ICs   Superseded by J-STD-020 and J-STD-033
Rev A 1/95
Orig. 12/90		  
IPC-MC-790 Guidelines for Multichip Module Technology Utilization    Orig. 8/92  
IPC-S-801   5-23a Superseded by IPC-804 and J-STD-003  
IPC-S-803   5-23a Superseded by IPC-804 and J-STD-003  
IPC-S-804 Solderability Test Methods for Printed Wiring Boards  5-23a Superseded by J-STD-003
Rev A 1/87
Orig. 1/82		  
IPC-S-805 Solderability Tests for Component Leads and Terminations  5-23b Superseded by
J-STD-002
Orig. 1/85		  
IPC-MS-810 Guidelines for High Volume Microsection    No Longer Maintained*
Orig. 10/93		  
IPC-S-815 General Requirements for Soldering Electronic Interconnections    Superseded byJ-STD-001
Rev B 12/87
Rev A 6/81
Orig. 11/77		  
IPC-S-816 SMT Process Guideline and Checklist    No Longer Maintained*
Orig. 7/93		  
IPC-SM-817 General Requirements for Dielectric Surface Mounting Adhesives  5-21k No Longer Maintained*
Rev A 12/14
Orig. 11/89		  
IPC-SF-818 General Requirement for Electronic Soldering Fluxes  5-24a Superseded by J-STD-004
Rev 12/91
Orig. 2/88		  
IPC-SP-819 General Requirements and Test Methods for Electronic Grade Solder Paste  5-24b Superseded by J-STD-005
Orig. 10/88		  
IPC-AJ-820 Assembly and Joining Handbook 7-35 No Longer Maintained*
Rev A 2/12
Orig. 4/97		  
IPC-CA-821 General Requirements for Thermally Conductive Adhesives    No Longer Maintained*
Orig. 1/95		  
IPC-CC-830 Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies  5-33a Rev C  1/19
Rev B  Amend 1 10/08
Rev B 8/02
Rev A Amend 1 7/99
Rev A 10/98
Orig. 1/84		  
IPC-HDBK-830 Guidelines for Design, Selection and Application of Conformal Coatings 5-33c Rev A 8/13
Orig. 10/02		  
IPC-SM-839 Pre and Post Solder Mask Application Cleaning Guidelines   

Superseded by IPC-CH-65
Orig. 4/90

  
IPC-SM-840 Qualification and Performance Specification  of Permanent Solder Mask and Flexible Cover Materials  5-33b Rev E 12/10
Rev D 4/07
Rev C Amend 1 6/00
Rev C 1/96
Rev B 5/88
Rev A 7/83
Orig. 11/77		 08/83
IPC-HDBK-840 Solder Mask Handbook   Orig. 9/06  
IPC-HDBK-850 Guidelines for Design, Selection and Application of Potting and Encapsulation Materials Used for Electronics Printed Circuit Board Assembly 5-33f Orig. 7/12  
IPC-H-855 Hybrid Microcircuit Design Guide    Obsolete without replacement
Orig. 10/82		  
IPC-D-859 Design Standard for Thick Film Multilayer Hybrid Circuits    No Longer Maintained*
Orig. 12/89		  
IPC-HM-860 Specification for Multilayer Hybrid Circuits    No Longer Maintained*
Orig. 1/87		  
IPC-TF-870 Qualification and Performance of Polymer Thick Film Printed Boards    No Longer Maintained*
Orig. 11/89		  
IPC-ML-910 Design and End Production Specification for Rigid Multilayer Printed Boards  D-31b & D-33a Superseded by IPC-D-949, IPC-D-275, and subsequently IPC-2221 for Design and IPC-ML-950, IPC-RB-276, and subsequently IPC-6011 for End Product Specification
Rev A  8/76
Orig.  6/68		  
IPC-D-949 Design Standard for Rigid Multilayer Printed Boards  D-31b Superseded by IPC-D-275 and subsequently by IPC-2221/2222
Orig. 1/87		  
IPC-ML-950 Performance Specification for Rigid Multilayer Printed Boards  D-33a Superseded by IPC-RB-276 and subsequently IPC-6011/6012
Rev C 11/8
Rev B 12/77
Rev A 9/70
Orig. 1/66		  
IPC-ML-960 Qualification and Performance Specification for Mass Laminated Panels for Multilayer Printed Boards  D-33b No Longer Maintained*
Orig. 7/94		  
IPC-ML-975 End Product Documentation Specification for Multilayer Printed Wiring Boards    Superseded by IPC-D-325
Orig. 9/69		  
IPC-ML-990 Performance Specification for Flexible Multilayer Wiring  D-33a Superseded by IPC-6011
Orig. 9/72		  
IPC-TP-1043 Cleaning & Cleanliness Test Program Phase 3 Water Soluble Fluxes Part 1    No Longer Maintained*
Orig. 8/92		  
IPC-TP-1044 Cleaning & Cleanliness Test Program Phase 3 Water Soluble Fluxes Part 2    No Longer Maintained*
Orig. 10/92		  
IPC-1065 Material Declaration Handbook 4-34a No Longer Maintained*
Orig. 1/05		  
IPC-1066 Labeling of PCBs and Assemblies 4-34b Superseded by J-STD-609
Orig. 12/04		  
IPC-1071 Intellectual Property Protection in Printed Board Manufacturing E-20 Superseded by IPC-1791
Rev B  5/16
Rev A  7/14
Orig.  1/11		  
IPC-1072 Intellectual Property Protection in Assembly Manufacturing E-21 Superseded by IPC-1791
Am 1  3/17
Orig. 2/16		  
IPC-WP-1081 White Paper on Conflict Minerals Due Diligence Guidance E-30 No Longer Maintained*
Orig. 8/13		  
IPC-TP-1090 The Layman’s Guide to Qualifying New Fluxes for MIL-STD-2000A or MT-0002    No Longer Maintained*
Orig. 7/96		  
IPC-TP-1103 Manufacturing Concerns When Soldering with Gold Plated Component Leads or Circuit Board Pads    Obsolete without replacement  
IPC-TP-1114 The Layman’s Guide to Qualifying a Process to J-STD-001B    No Longer Maintained*
Orig. 1/98		  
IPC-TP-1115 Selection and Implementation Strategy for A Low-Residue No-Clean Process    No Longer Maintained*
Orig. 12/98		  
IPC-1131 IT Guidelines for PWB Manufacturers  2-20 No Longer Maintained*
Orig. 4/00		  
IPC-1331 Voluntary Safety Standard for Electrically Heated Process Equipment    No Longer Maintained*
Orig. 3/00		  
IPC-1401 Corporate Social Responsibility
and Sustainability Protocols for
Electronic Manufacturing Industry		 4-35CN Rev. A 11/21
Orig. 3/17		  
IPC-1601 Printed Board Handling and Storage Guidelines D-35

Superseded by IPC-1602
Rev A 6/16
Orig. 8/10

  
IPC-1602 Standard for Printed Board Handling and Storage D-35 Orig.  4/20  
IPC-1710 OEM Standard for Printed Board Manufacturers’ Qualification Profile (MQP)    No Longer Maintained*
Rev A 7/04
12/97 updated
Orig. 2/94		  
IPC-1720 Assembly Qualification Profile (AQP)    No Longer Maintained*
Rev A 7/04
Orig. 7/96		  
IPC-1730 Laminator Qualification Profile (LQP)    No Longer Maintained*
Rev A 6/00
Orig. 1/98		  
IPC-1731 Strategic Raw Materials Supplier Qualification Profile  3-12i No Longer Maintained*
Orig. 6/00		  
IPC-1751 Generic Requirements for Declaration Process Management E-31a No Longer Maintained*
Rev A w/Amend 1  12/12
Rev A  2/10
Vers. 1.1  3/07
Orig. 3/06		  
IPC-1752 Materials Declaration Management E-31b Rev B 7/20
Rev A. w/Amend 1&2    2/14
Rev A w/Amend 1   12/12
Rev A 2/10
Vers. 1.1 3/07
Orig. 3/06		  
IPC-1753 Laboratory Report Standard E-31j Am 1 5/18
Orig. 2/14		  
IPC-1754 Materials and Substances  Declaration for Aerospace and Defense and Other Industries E-31k Am 2  6/20
w/Amend 1 3/19
Orig 6/18		  
IPC-1755 Conflict Minerals Data Exchange Standard E-31h

Rev. A w/am1 10/21
Rev A 5/20
w/Amend 1&2 4/17
Am 1  4/15
Orig. 4/14

  
IPC-1756 Manufacturing Process Data Management   No Longer Maintained*
Orig. 4/10		  
IPC-1758 Declaration Requirements for Shipping, Pack and Packing Materials   No Longer Maintained*
Orig. 3/12		  
IPC-1782 Standard for Manufacturing and Supply Chain Traceability of Electronic Products  2-19a

Rev B 10/23
Rev A 11/20
Orig. 11/16

 04/21
IPC-1791 Trusted Electronic Designer, Manufacturer, and Assembler Requirements  2-19b

Rev D 11/23
Rev C 3/23
Rev B 8/21
Am 1  3/19
Orig.  9/18
Supersedes IPC-1071 and IPC-1072
IPC-1792 Standard for Cybersecurity Management in the Manufacturing Industry Supply Chain 2-12C Orig. 11/22  
IPC-2141 Controlled Impedance Circuit Boards and High Speed Logic Design  D-21c No Longer Maintained*
Rev A 3/04
Amend 1  2/99
Orig. 4/96		 12/09
IPC-2152 Standard for Determining Current Carrying Capacity in Printed Board Design 1-10b No Longer Maintained*
Orig. 8/09		 02/11
IPC-2221 Generic Standard on Printed Board Design  D-31b Rev C 12/23
Rev B 11/12
Rev A 5/03
Amend 1  1/00
Orig. 2/98
Supersedes IPC-D-275		 09/99
IPC-2222 Sectional Design Standard for Rigid Organic Printed Boards  D-31b Rev B 10/20
Rev A 12/10
Orig. 2/98
Supersedes IPC-D-275		  
IPC-2223 Sectional Design Standard for Flexible Printed Boards  D-11 Rev E  1/20
Rev D  9/16
Rev C 11/11
Rev B 5/08
Rev A 6/04
Orig. 11/98
Supersedes IPC-D-249		 09/99
IPC-2224 Sectional Standard for Design of PWBs for PC Cards  1-21 Obsolete
Orig. 1/98		  
IPC-2225 Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies  D-31c No Longer Maintained*
Orig. 5/98		  
IPC-2226 Sectional Design Standard for High Density Interconnect (HDI) Printed Boards  D-31b No Longer Maintained*
Rev A  9/17
Orig. 4/03		 03/09
IPC-2228 Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards D-21 Orig. 10/22
Supercedes IPC-2252		  
IPC-2231 DFX Guidelines 1-14 Rev. A 10/21
Orig. 5/19		  
IPC-2251 Design Guide for the Packaging of High Speed Electronic Circuits D-21a No Longer Maintained*
Orig. 12/03		 08/09
IPC-2252 Design and Manufacturing Guide for RF/Microwave Circuit Boards  D-21b Superceded by IPC-2228 10/22
Orig. 7/02		  
IPC/JPCA-2291 Design Guideline for Printed Electronics D-61 No Longer Maintained*
Orig. 7/13		  
IPC-2292 Design Standard for Printed Electronics on Flexible Substrates  D-61 No Longer Maintained*
Orig. 3/18		  
IPC-2294 Design Standard for Printed Electronics on Rigid Substrates D-61B Orig. 6/24  
IPC/JPCA-2315 Design Guide for High Density Interconnects (HDI) and Microvia  D-41a No Longer Maintained*
Orig. 6/00		  
IPC-2316 Design Guide for Embedded Passive Device Printed Boards D-37a No Longer Maintained*
Orig. 3/07		  
IPC-2501 Definition for Web-based Exchange of XML Data 2-50 No Longer Maintained*
Orig. 7/03		  
IPC-2511 Generic Requirements for Implementation of Product Manufacturing Description Data and Transfer Methodology  2-11 No Longer Maintained*
ev B  1/02
Rev A  1/00
Orig. 1 1/98		  
IPC-2512 Sectional Requirements for Implementation of Administrative Methods for Manufacturing Data Description  2-11 No Longer Maintained*
Rev A 11/00
Orig. 11/98		  
IPC-2513 Sectional Requirements for Implementation of Drawing Methods for Manufacturing Data Description 2-11 No Longer Maintained*
Rev A 11/00		  
IPC-2514 Sectional Requirements for Implementation of Printed Board Manufacturing Data Description  2-11 No Longer Maintained*
Rev A 11/00		  
IPC-2515 Sectional Requirements for Implementation of Bare Board Product Electrical Testing Data Description 2-11 No Longer Maintained*
Rev A 11/00		  
IPC-2516 Sectional Requirements for Implementation of Assembled Board Product Manufacturing Data Description  2-11 No Longer Maintained*
Rev A 11/00		  
IPC-2517 Sectional Requirements for Implementation of Assembly In-Circuit Testing Data Description 2-11 No Longer Maintained*
Rev A 11/00		  
IPC-2518 Sectional Requirements for Implementation of Part List Product Data Description  2-11 No Longer Maintained*
Rev A 11/00		  
IPC-2524 PWB Fabrication Data Quality Rating System  2-10 No Longer Maintained*
Orig. 2/99		  
IPC-2531 Standard Recipe File Format Specification  2-12 No Longer Maintained*
Orig. 3/99		  
IPC-2541 Generic Requirements for Electronic Manufacturing Shop Floor Equipment Communication  2-13a No Longer Maintained*
Orig. 10/01		  
IPC-2546 Sectional Requirements for Shop Floor Electronic Assembly Equipment Communication  2-13b No Longer Maintained*
Amend 2  1/05
Amend 1  1/03
Orig. 10/01		  
IPC-2547 Sectional Requirements for Shop Floor Electronic Inspection and Test Equipment Communication  2-13c No Longer Maintained*
Orig. 1/02		  
IPC-2551 International Standard for Digital Twins 2-12a Orig. 12/20  
IPC/DAC-2552 General Electronic Components Model Based Definition (MBD) Standard 2-12b Orig. 1/22  
IPC-2571 Generic Requirements for Electronic Manufacturing Supply Chain Communication-Product Data Exchange (PDX)  2-15a No Longer Maintained*
Orig. 11/01		  
IPC-2576 Sectional Requirements for Electronics Manufacturing Supply Chain Communication of As-Built Product Data – Product Exchange (PDX)  2-15c No Longer Maintained*
Orig. 11/01		  
IPC-2578 Sectional Requirements for Supply Chain Communication of Bill of material and Product Design Configuration Data-Product Data Exchange (PDX)  2-15e No Longer Maintained*
Orig. 11/01		  
IPC-2581 Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology 2-16

Rev C 11/20
Rev B Am 1  1/17
Rev B 9/13
Rev A 5/12
Amend 1  5/07
Orig. 3/04

  
IPC-2582 Sectional Requirements for Implementation of Design Characteristics for Manufacturing Data Description 2-17 No Longer Maintained*
Orig. 5/07		  
IPC-2583 Sectional Requirements for Implementation of Administrative Methods for Manufacturing Data Description 2-17 No Longer Maintained*
Orig. 5/07		  
IPC-2584 Sectional Requirements for Implementation of Printed Board Fabrication Data Description 2-17 No Longer Maintained*
Orig. 5/07		  
IPC-2588 Sectional Requirements for Implementation of Part List Product Data Description 2-17 No Longer Maintained*
Orig. 5/07		  
IPC-2591 Connected Factory Exchange (CFX) 2-17

Ver 1.7 8/23
Ver 1.6 3/23
Ver 1.5 7/22
Ver 1.4 1/22
Ver 1.3 2/21
Ver 1.2  9/20
Ver 1.1  1/20
Orig. 4/19

  
IPC-2611 Generic Requirements for Electronic Product Documentation 2-40 No Longer Maintained*
Orig. 4/10		  
IPC-2612 Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions) 2-40 No Longer Maintained*
Orig. 4/10		  
IPC-2612-1 Sectional Requirements for Electronic Diagramming Symbol Generation Methodology 2-40 No Longer Maintained*
Orig. 4/10		  
IPC-2614 Sectional Requirements for Board Fabrication Documentation 2-40 No Longer Maintained*
Orig. 4/10		  
IPC-2615 Printed Board Dimensions and Tolerances  1-10a No Longer Maintained*
Orig. 7/00
Supersedes IPC-D-300		 11/10
IPC/PERM-2901 Pb-free Design & Assembly Implementation Guide   No Longer Maintained*
Orig. 2/18		  
IPC-3406 Guidelines for Electrically Conductive Surface Mount Adhesives  5-24d No Longer Maintained*
Orig. 7/96		  
IPC-3408 General Requirements for Anistropically Conductive Adhesive Films  5-24d No Longer Maintained*
Orig. 11/96		  
IPC-4101 Specification for Base Materials for Rigid and Multilayer Printed Boards  3-11

Rev E WAM1 4/22
Rev E 4/17
Rev D WAM 1  8/15
Rev D 4/14
Rev C 8/09
Rev B Amends 1&2  4/07
Rev B Amend 1  2/07
Rev B  6/06
Rev A Amend 1 6/02
Rev A 6/02
Supersedes IPC-L-108, IPC-L-109, IPC-L-112, IPC-L-115
Orig. 12/97

  
IPC-4103 Specification for Base Materials for High Speed/ High Frequency Applications D-23 No Longer Maintained*
Rev B  11/17
Rev A Amend 1  3/14
Rev A 12/11
Orig. 1/02
Supersedes IPC-L-125		  
IPC/JPCA-4104 Specification for High Density Interconnect (HDI) and Microvia Materials  D-42a No Longer Maintained*
Orig. 5/99		  
IPC-4110 Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards  3-12g No Longer Maintained*
Orig. 8/98		  
IPC-4121 Guidelines for Selecting Core Constructions for Multilayer Printed Wiring Board Applications  3-11c No Longer Maintained*
Orig. 1/00
Supersedes IPC-CC-110		  
IPC-4130 Specification and Characterization Methods for Nonwoven “E” Glass Mat  3-12f No Longer Maintained*
Orig. 9/98		  
IPC-4202 Flexible Base Dielectrics for Use in Flexible Printed Wiring  D-13 Rev C 01/22
Rev B 12/16
Rev A  4/10
Orig. 5/02
Supersedes IPC-FC-231C		 02/03
IPC-4203 Adhesive Coated Dielectric Films for Use as Cover Sheets  D-13 Rev B  5/18
Rev A Am1 10/14
Rev A 1/13
Orig. 5/02
Supersedes IPC-FC-232C		 02/03
IPC-4204 Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards D-13 Rev B  9/18
Rev A Amend 1  2/14
Rev A 10/11
Orig. 5/02
Supersedes IPC-FC-241C		 02/03
IPC-4411 Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement  3-12b No Longer Maintained*
Rev A 11/03
Orig. 4/99		  
IPC-4412 Specification for Finished Fabric Woven form “E” Glass for Printed Boards  3-12d Rev C 9/21
Rev B Am3  12/18
Rev B Am2  5/18
Rev B 5/13
Rev A w/Amends 1, 2 & 3  7/11
Rev A Amend 3 12/10
Rev A Amend 2  5/09
Rev A Amend 1  3/08
Rev A 1/06
Orig. 6/02
Supersedes IPC-EG-140		 02/03
IPC-4552 Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards  4-14 Rev B 5/21
Rev A  8/17
w/Amend 1&2  12/12
w/Amend 1  6/12
Orig. 10/02		  
IPC-4553 Specification for Immersion Silver Plating for Printed Circuit Boards 4-14 No Longer Maintained*
Rev A 5/09
Orig. 6/05		  
IPC-4554 Specification for Immersion Tin Plating for Printed Circuit Boards 4-14 No Longer Maintained*
Amend 1  9/11
Orig. 2/07		  
IPC-4555 Performance Specification for High Temperature Organic Solderability Preservatives (OSP) for Printed Boards 4-14e Orig. 4/22  
IPC-4556 Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards 4-14 Amend 1  1/16
Orig. 1/13		  
IPC-4562 Metal Foil for Printed Wiring Applications 3-12a Rev B 10/23
Rev A WAM1 3/16
Rev A 4/08
Amend 1 5/05
Orig. 5/00
Supersedes IPC-MF-150F		 02/03
IPC-4563 Resin Coated Copper Foil for Printed Boards Guideline 3-12c No Longer Maintained*
Orig. 11/07
Supercedes CF-148A		  
IPC/JPCA-4591 Requirements for Printed Electronics Functional Conductive Materials D-63 No Longer Maintained*
Rev A  2/18
Orig. 12/12		  
IPC-4592 Requirements for Printed Electronics Functional Dielectric Materials  D-63a Orig. 8/22  
IPC-HDBK-4691 Handbook on Adhesive Bonding in Electronic Assembly Operations 5-11c No Longer Maintained*
Orig. 1/16		  
IPC-4761  Design Guide for Protection of Printed Board Via Structures D-33d No Longer Maintained*
Orig. 7/06		  
IPC-4781 Qualification and Performance Specification of Permanent, Semi-Permanent and Temporary Legend and/or Marking Inks 5-33e No Longer Maintained*
Orig. 5/08		  
IPC-4811 Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards D-52 No Longer Maintained*
Orig. 4/08		  
IPC-4821 Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards D-52 No Longer Maintained*
Amend 1  4/10
Orig. 5/06		  
IPC-4921 Requirements for Printed Electronics Base Materials  D-62 No Longer Maintained*
Rev A  6/17
Orig. 6/12		  
IPC-4922 Requirements for Sintering Materials for Electronics Assembly 5-21P Orig. 1/24  
IPC-5262 Design, Critical Process and Acceptance Requirements for Polymeric Applications 5-24G Orig. 7/22  
IPC-5701 Users Guide for Cleanliness of Unpopulated Printed Boards 5-32c No Longer Maintained*
Orig. 7/03		  
IPC-5702 Guidelines for OEMs in Determining Acceptable Levels of Cleanliness of Unpopulated Printed Boards 5-32c No Longer Maintained*
Orig. 6/07		  
IPC-5703 Cleanliness Guidelines for Printed Board Fabricators 5-32c No Longer Maintained*
Orig. 5/13		  
IPC-5704 Cleanliness Requirements for Unpopulated Printed Boards 5-32c No Longer Maintained*
Orig. 12/09		  
IPC-6011 Generic Performance Specification for Printed Boards  D-33a No Longer Maintained*
Orig. 7/96		  
IPC-6012 Qualification and Performance Specification for Rigid Printed Boards  D-33a Rev F 9/23
Rev E Amend 1 4/22
Rev E  2/20
Rev D Amend 1  10/17
Rev D  09/15
Rev C  4/10
Rev B Amend 2  3/08
Rev B with Amend 1  2/07
Rev B 8/04
Rev A Amend 1  7/00
Rev A  10/99
Orig.  7/96		  
IPC-6012xA Automotive Applications Addendum to IPC-6012 Qualification and Performance Specification for Rigid Printed Boards  D-33aa Rev EA 3/22
Rev DA WAM 1  11/18
Rev DA  5/16		  
IPC-6012xS Space and Military Applications Addendum to IPC-6012 Qualification and Performance Specification for Rigid Printed Boards   

Rev FS 2/24
Rev ES  4/20
Rev DS 09/15

  
IPC-6012xM Medical Applications Addendum to IPC-6012 Qualification and Performance Specification for Rigid Printed Boards D-33AM Rev EM 8/20  
IPC-6012C-TC Test Coupon Addendum to IPC-6012C Qualification and Performance Specification for Rigid Printed Boards D-33ac No Longer Maintained*
Orig. 8/13		  
IPC-6013 Qualification and Performance Specification for Flexible Printed Boards  D-12

Rev E 9/21
Rev D Am 1  5/18
Rev D  9/17
Rev C  12/13
Rev B  1/09
Rev A with Amend 2  4/06
Rev A  Amend 1  1/05
Rev A  11/03
Supersedes IPC-RF-245 and IPC-FC-250
Amend 1  4/00
Orig. 11/98

  
IPC-6013xM Medical Applications Addendum to IPC-6013 Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Electronics. The addendum MUST be used with the same revision of the standard. D-33am Rev EM 3/22  
IPC-6015 Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures  D-33e No Longer Maintained*
Orig. 2/98		  
IPC-6016 Qualification and Performance Specification for High Density Interconnect (HDI) Layers or Boards  D-10 Superseded by IPC-6012, IPC-6013 and/or IPC-6018
Orig. 5/99		  
IPC-6017 Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices D-53

Rev A 08/21
Orig. 3/09

  
IPC-6018 Qualification and Performance Specification for High Frequency (Microwave) Printed Boards  D-22

Rev D 2/22
Rev C  7/16
Rev B 11/11
Rev A  1/02
Orig. 1/98

  
IPC-6018xS Space and Military Avionics Applications Addendum to IPC-6018, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards. The addendum MUST be used with the same revision of the standard. D-22 Rev. DS 8/22  
IPC/JPCA-6202 Performance Guide Manual for Single- and Double-Sided Flexible Printed Wiring Boards  D-14 No Longer Maintained*
Orig. 2/99		  
IPC/JPCA-6801 Terms & Definitions, Test Methods, and Design Examples for Build-Up/High Density Interconnection  D-40 No Longer Maintained*
Orig. 1/00		  
IPC/JPCA-6901 Application Categories for Printed Electronics D-64 No Longer Maintained*
Orig. 8/15		  
IPC-6902 Qualification and Performance Specification for Printed Electronics on Flexible Substrates D-64 Orig. 2/21  
IPC-6903 Terms and Definitions for the Design and Manufacture of Printed Electronics (Additive Circuitry) D-64a No Longer Maintained*
Rev A  3/18
Orig. 10/15		  
IPC-6904 Qualification and Performance Specifications for Printed Electronics on Rigid Substrates D-64B Orig. 6/24  
IPC-7091 Design and Assembly Process Implementation of 3D Components   Rev A 1/23
Orig. 9/17		  
IPC-7092 Design and Assembly Process Implementation for Embedded Components  D-55A Rev A 11/22
Orig. 2/15		  
IPC-7093 Design and Assembly Process Implementation for Bottom Termination SMT Components 5-21h

Rev A 10/20
Orig. 3/11

  
IPC-7094 Design and Assembly Process Implementation for Flip Chip and Die Size Components 5-21g No Longer Maintained*
Rev A  3/18
Orig. 1/09		  
IPC-7095 Design and Assembly Process Implementation for BGAs  5-21f WAM 1  6/19
Rev D  3/18
Rev C 1/13
Rev B  3/08
Rev A 11/04
Orig. 8/00		  
IPC-7351 Generic Requirements for Surface Mount Design and Land Pattern Standard 1-13 No Longer Maintained*
Rev B 6/10
Rev A  2/07
Supersedes IPC-SM-782A w/Amend1&2
Orig.  2/05		  

 IPC-7352

 Generic Guideline for Land Pattern Design 1-13 Orig. 7/23  
IPC-7525 Guidelines for Stencil Design  5-21e

Rev C 11/21
Rev B 10/11
Rev A  2/07
Orig.  5/00

  
IPC-7526 Stencil and Misprinted Board Cleaning Handbook 5-31g

Rev. A 3/22
Orig.  2/07

  
IPC-7527 Requirements for Solder Paste Printing 5-21jND Orig. 5/12  
IPC-7530 Guidelines for Temperature Profiling for Mass Soldering Processes  (Wave and Reflow) 5-22h Rev A 4/17
Orig.  5/01		  
IPC-7535 Solder Dross Reduction in Wave Soldering Process 5-22jcn No Longer Maintained*
Orig.  2/17		  
IPC-7621 Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics    Orig.  3/18  
IPC-7711/21 Rework, Modification and Repair of Electronic Assemblies 7-34 Rev D 1/24
Am 1  7/20
Rev C  1/17
Rev B  11/07
Rev A  10/03
Orig.  4/98
Supersedes IPC-R-700C		  
IPC-7801 Reflow Oven Process Control Standard 5-45 Rev A 8/22
Orig. 4/15		  
IPC-7912 Calculation of DPMO and Manufacturing Indices for Printed Wiring Assemblies  5-22g No Longer Maintained*
Rev A  1/04
Orig.  7/00		  
IPC-8413-1 Specification for Manufacturing Process Carriers for Handling Optical Fiber 5-25a No Longer Maintained*
Orig.  4/03		  
IPC-8497-1 Cleaning Methods and Contamination Assessment for Optical Assembly 5-25e No Longer Maintained*
Orig. 12/05		  
IPC-8701 Final Acceptance Criteria Standard for PV Modules-Final Module Assembly E-15 No Longer Maintained*
Orig. 7/14		  
IPC-8921 Requirements for Woven and Knitted Electronic Textiles (E-Textiles) Integrated with Conductive Fibers, Conductive Yarns and/or Wires  D-72 Orig. 10/19  
IPC-8952 Design Standard for Printed Electronics on Coated or Treated Textiles and E-Textiles D-73A Orig. 12/22  
IPC-8971 Requirements for Electrical Testing of Printed Electronics on E-Textiles D-74A Orig. 11/22  
IPC-9111 Troubleshooting for Printed Board Assembly Processes 7-23 Orig.  1/19  
IPC-9121 Troubleshooting for Printed Board Fabrication Processes 7-24

Rev A 2/22
Am 2  9/19
Am 1  5/18
Orig. 3/16
Supersedes PWB sections of IPC-PE-740

  
IPC-9151 Printed Board Capability, Quality and Relative Reliability (PCQR2) Benchmark Test Standard and Database D-36 Withdrawn 7/24
Rev D 5/12
Rev C 5/10
Rev B  2/07
Rev A 5/03
Orig.  6/02		  
IPC-9191 General Guideline for implementation of Statistical Process Control (SPC)  7-22 No Longer Maintained*
Orig. 11/99
Supersedes IPC-PC-90		 02/03
IPC-9194 Implementation of Statistical Process Control (SPC) Applied to Printed Board Assembly Manufacture Guideline 7-22 No Longer Maintained*
Orig.  9/04		  
IPC-9199 SPC Quality Rating  7-22 No Longer Maintained*
Orig.  9/02		  
IPC-9201 Surface Insulation Resistance Handbook  5-32b No Longer Maintained*
Rev A  8/07
Orig.  7/96		  
IPC-9202 Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance 5-32b Rev A 10/22
Orig. 10/11		  
IPC-9203 Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle 5-32b Rev A 11/22
Orig. 5/12		  
IPC-9204 Standard Only: Guideline on Flexibility and Stretchability Testing for Printed Electronics D-65 Orig. 2/17  
IPC-9241 Guidelines for Microsection Preparation 7-12 No Longer Maintained*
Orig. 1/17		  
IPC-9251 Test Vehicles for Evaluating Fine Line Capability    Obsolete without replacement
Orig.  7/00		  
IPC-9252 Requirements for Electrical Testing of Unpopulated Printed Boards  7-32c No Longer Maintained*
Rev B  9/16
Rev A Amend 1  10/12
Rev A  11/08
Orig. 2/01
Supersedes IPC-ET-652A		 04/09
IPC-9257 Requirements for Electrical Testing of Flexible Printed Electronics D-65a Orig. 2/21  
IPC-9261 In-Process DPMO and Estimated Yield for PWAs  5-22g No Longer Maintained*
Rev A 10/06
Orig. 3/02		  
IPC-9262 Specification for Characterization and Verification of Assembly Level Automatic Optical Inspection Equipment 7-32CN No Longer Maintained*
Orig. 2/17		  
IPC/JEDEC-9301 Numerical Analysis Guidelines for Microelectronics Packaging Design and Reliability 6-10D Orig. 1/19  
IPC-9501 PWB Assembly Process Simulation for Evaluation of Electronic Components  5-21c No Longer Maintained*
Orig. 7/95		  
IPC-9502 PWB Assembly Soldering Process Guidelines for Non-IC Electronic Components  5-21c No Longer Maintained*
Orig. 4/99		  
IPC-9503 Moisture Sensitivity Classification for Non-IC Components    Superseded by J-STD-075  8/08
Orig. 4/99		  
IPC-9504 Assembly Process Simulation for Evaluation of Non-IC Components  5-21c No Longer Maintained*
Orig. 6/98		  
IPC-9505 Guideline Methodology for Assessing Component and Cleaning Materials Compatibility 5-31j No Longer Maintained*
Orig. 10/17		  
IPC-9591 Performance Parameters (Mechanical, Electrical, Environmental and Quality/Reliability) for Air Moving Devices 9-81 No Longer Maintained*
Orig.  4/06		  
IPC-9592 Requirements for Power Conversion Devices for the Computer and Telecommunications Industries 9-81 No Longer Maintained*
Rev B 1/13
Rev A  5/10
Orig.  9/08		  
IPC-9631 User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation D-32 No Longer Maintained*
Orig. 12/10		  
IPC-9641 High Temperature Printed Board Flatness Guideline 6-11 No Longer Maintained*
Orig. 6/13		  
IPC-9691 User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Migration Testing) 5-32e No Longer Maintained*
Rev B  9/16
Rev A  8/07
Orig. 10/05		  
IPC-9701 Qualification and Performance Test Methods for Surface Mount Solder Attachments  6-10d

Rev B 2/22
Rev A  2/06
Orig.  1/02

  
IPC/JEDEC-9702 Monotonic Bend Characterization of Board-Level Interconnects 6-10d No Longer Maintained*
w/Am 1  8/15
Orig.  6/04		  
IPC/JEDEC-9703 Mechanical Shock Test Guidelines for Solder Joint Reliability 6-10d No Longer Maintained*
Orig.  3/09		  
IPC/JEDEC-9704 Printed Circuit Assembly Strain Gage Test Guideline 6-10d No Longer Maintained*
Rev A 2/12
Orig.  6/05		  
IPC/JEDEC-9706 Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and Pad Crater/Trace Crack Detection 6-10d No Longer Maintained*
Orig. 1/14		  
IPC/JEDEC-9707 Spherical Bend Test Method for Characterization of Board Level Interconnects 6-10d No Longer Maintained*
Am 1 5/18
Orig. 9/11		  
IPC-9708 Test Methods for Characterization of Printed Board Assembly Pad Cratering 6-10d No Longer Maintained*
Orig. 12/10		  
IPC-9709 Test Guidelines for Acoustic Emission Measurement during Mechanical Test 6-10d Rev A 11/21
Orig. 12/13		  
IPC-9797 Press-fit Standard for Automotive Requirements and other High-Reliability Applications 5-21M Orig. 6/20  
IPC-HDBK-9798 Handbook for Press-fit Standard for Automotive Requirements and Other High-Reliability Applications 5-21n Orig. 4/22  
IPC-9850 Surface Mount Equipment Performance Characterization    No Longer Maintained*
Rev A 11/11
Orig.  7/02		  
IPC-SMEMA-9851 Equipment Interface Specification   No Longer Maintained*
Orig. 11/04		  
IPC-HERMES-9852 The Global Standard for Machine-to-Machine Communication in SMT Assembly   

Orig. 6/19

  
IPC-QRG-PTH
(Prev: IPC-DRM-PTH, IPC-DRM-40)

Through-Hole Solder Joint Evaluation Desk Reference Manual 

 

   Rev H  9/21
Rev G  2/18
Rev F  5/15
Rev E 7/10
Rev D (2nd print) 11/08
Rev D 11/05
Renamed to DRM-PTH
Rev E 2/02
Rev D 7/00
Rev C 9/99
Rev B 1/99
Rev A 8/97
Orig. 5/97		  
IPC-QRG-SMT
(Prev: IPC-DRM-SMT)		 Surface Mount Solder Joint Evaluation Desk Reference Manual    Rev H  3/22
Rev G  2/18
Rev F  5/15
Rev E  8/10
Rev D 12/05
Rev C 10/01
Rev B 4/00
Rev A 3/99
Orig. 7/98		  
IPC-DRM-WHA
(IPC-DRM-56)		 Wire Preparation & Crimping   Rev D 2/22
Rev C 6/17
Rev B 3/13
Rev A 11/06
Renamed DRM-WHA
Orig.  7/02		  
IPC-EMSI-TC IPC Sample Master Ordering Agreement for EMS Companies and OEMs   No Longer Maintained*
Orig.  3/02		  
Roadmap International Technology Roadmap for Electronic Interconnections  8-40 No Longer Maintained*
Updated 2015
Updated 2013
Updated 2011
Updated 2009
Updated 2007
Updated 2005
Updated 2003
Updated 2001
Updated 9/97
Orig. 6/95		  

 

*"No Longer Maintained" - Indicates that the document is not expected to be in revision at this time. Documents may be taken out of this status in the future if a committee decides to revise or reaffirm the document.